RAK3272-SiP Breakout Board
Thank you for choosing RAK3272-SiP Breakout Board in your awesome IoT project! 🎉 To help you get started, we have provided you with all the necessary documentation for your product.
Product Description
The RAK3272-SiP and RAK3272LP-SiP Breakout Boards were designed to allow easy access to the RAK3172-SiP/RAK3172LP-SiP module pins to simplify development and testing. The two SiP module variants use different RF output paths to optimize current consumption depending on the application. RAK3172-SiP uses RFO_HP while RAK3172LP-SiP uses the RFO_LP on the STM32WL SoC transceiver.
The microcontroller GPIO pins are accessible via 2.54 mm headers. The breakout board itself has a RAK3172-SiP or RAK3172LP-SiP (based on STM32WLE5JC) as its core. The STM32WLE5JC is part of the STM32WLE5x family. This core is based on an Arm® Cortex®‐M4 core running at 48 MHz, and a sub-GHz radio based on Semtech SX126x.
The board complies with Class A, B, & C of LoRaWAN 1.0.3 specifications and also features LoRa Point-to-Point (P2P) communication mode, which helps you in implementing your own customized long-range LoRa network quickly. It is also RUI3 compatible which allows you to create custom firmware using RUI3 APIs.
Product Features
- 32-bit Arm® Cortex®‐M4 48 MHz MCU and sub-GHz Semtech SX126x radio
- Chipset STM32WLE5JC (single-core)
- Two variants available
- RAK3272-SiP (uses RFO_HP)
- RAK3272LP-SiP (uses RFO_LP)
- I/O ports: UART/I2C/GPIO/SPI
- 32 MHz TXCO and 32 kHz xtal
- RUI3 API compatible
- Custom firmware using Arduino via RUI3 API
- Easy to use AT Command set via UART interface
- Serial Wire Debug (SWD) interface
- LoRaWAN 1.0.3 specification compliant
- Supported bands: IN865, EU868, AU915, US915, KR920, RU864, and AS923
- Supply voltage: 1.8 V ~ 3.6 V
- Temperature range: -40° C ~ 85° C
- Size: 25.4 mm x 41.8 mm
