RAK811 Breakout Board Datasheet
Overview
Description
RAK811 Breakout Board is an easy-to-use, compact, and low-power long-range LoRa technology with wireless transceiver capabilities. It is based on RAK811 Stamp Module attached to a breakout board on Xbee form factor with standard 2.00 mm headers.
The RAK811 Breakout Board complies with Class A & C of LoRaWAN 1.0.2 specification. Additionally, it supports LoRa Point-to-Point (P2P) communications, which help you in implementing their own private LoRa wireless applications. You can configure the mode and operation of the module using AT commands via the UART interface. RAK811 board also offers low-power features, which are very suitable for battery-powered applications.
Features
- Based on Semtech SX1276.
- LoRaWAN 1.0.2 specification compliant.
- Supported bands: EU433, CN470, IN865, EU868, AU915, US915, KR920, and AS923.
- LoRaWAN Activation by OTAA/ABP.
- LoRa Point-to-Point (P2P) communication.
- Integrates both SMA and iPEX antenna connectors.
- Xbee form factor with standard 2.00 mm headers.
- Easy to use AT Command Set via UART interface with configurable baud rate.
- Maximum output power 100 mW (20 dBm), adjustable from 5 to 20 dBm.
- High sensitivity at -148 dBm, enabling extremely long range connectivity.
- Long-range - greater than 15 km with optimized antenna.
- Low power consumption: 11 μA on on standby.
- Ultra-Low Power Consumption of 11.9 μA (down to 1.11 μA @ 2.1 V) in sleep mode.
- Multi-channel, dual data buffer (256 bytes each).
- LoRa/FSK/GFSK/OOK modulation, bidirectional two-way communication.
- Long battery life for battery-powered applications.
- LoRa technology is capable of demodulating 20 dB below noise level which significantly improves immunity to interference when combined with integrated forward error correction.
- Operating temperature: -30° C ~ 85° C (industrial grade)
- Storage temperature: -40° C ~ 85° C (non-condensing)
Specifications
This section covers the hardware and software specifications of the RAK811 Breakout Board. All discussion presents both versions: RAK811(L) and RAK811(H).
Overview
The RAK811 Breakout Board is shown in Figure 1 with its corresponding board dimension of 42 mm x 25 mm. This board weighs at about 0.2 kg.
Figure 8281: RAK811 Breakout Board DimensionsHardware
The hardware specification is categorized into six parts. It discusses the pinouts of the board and its corresponding functions and diagrams. It also covers the RF, electrical, environmental, and mechanical parameters that include the tabular data of the functionalities and standard values of the RAK811 Breakout Board.
Interfaces
| Module | Interfaces |
|---|---|
| RAK811 Breakout Board | UART1, GPIOs |
Pin Definition
The RAK811 Breakout Board supports two different frequency variations: Low Radio Frequency and High Radio frequency.
1. Low Radio Frequency (RAK811(L))
The low radio frequency is applicable to the bandwidth of regions EU433 and CN470. For more information, refer to the RF Characteristics.
Low RF Pin Outline
Figure 8282: Board Pinout for RAK811 Breakout Low RFLow RF Pin Definition
| Pin No. | Name | Type | Description |
|---|---|---|---|
| 1 | VCC 3.3 V | P | Main Power Voltage Source Input |
| 2 | PA9/UART1_TX | O | UART1 Interface (AT Commands and FW Update) |
| 3 | PA10/UART1_RX | I | UART1 Interface (AT Commands and FW Update) |
| 4 | PB12/ADC | I/O | GPIO and ADC |
| 5 | RST | I | Reset Trigger Input, Low Active |
| 6 | PA3/ADC | I/O | GPIO and ADC |
| 7 | PB5 | I/O | GPIO only |
| 8 | PA12 | I/O | GPIO only |
| 9 | PB4 | Boot mode GPIO enable pin - high active | |
| 10 | GND | Ground connections | |
| 11 | PA0/ADC | I/O | GPIO and ADC |
| 12 | PA1/ADC | I/O | GPIO and ADC |
| 13 | PA14 | SWD Debug Pin (SWCLK) | |
| 14 | PA13 | SWD Debug Pin SWDIO | |
| 15 | PA11 | I/O | GPIO only |
| 16 | PB15/ADC | I/O | GPIO and ADC |
| 17 | PA2/ADC | I/O | GPIO and ADC |
| 18 | PB13/ADC | I/O | GPIO and ADC |
| 19 | PA12/ADC | I/O | GPIO and ADC |
| 20 | PB14/ADC | I/O | GPIO and ADC |
2. High Radio Frequency (RAK811(H))
The high radio frequency hardware supports the regions of EU868, US915, AU915, KR920, AS923, and IN865. For more information, refer to the RF Characteristics.
High RF Pin Outline
Figure 8283: Board Pinout for RAK811 Breakout High RFHigh RF Pin Definition
| Pin No. | Name | Type | Description |
|---|---|---|---|
| 1 | VCC 3.3 V | P | Main Power Voltage Source Input |
| 2 | PA9/UART1_TX | O | UART1 Interface (AT Commands and FW Update) |
| 3 | PA10/UART1_RX | I | UART1 Interface (AT Commands and FW Update) |
| 4 | PB12/ADC | I/O | GPIO and ADC |
| 5 | RST | I | Reset Trigger Input, Low Active |
| 6 | PB3 | I/O | GPIO only |
| 7 | PB5 | I/O | GPIO only |
| 8 | PA15 | I/O | GPIO only |
| 9 | BOOT0 | Boot mode GPIO enable pin - high active | |
| 10 | GND | Ground connections | |
| 11 | PA0/ADC | I/O | GPIO and ADC |
| 12 | PA1/ADC | I/O | GPIO and ADC |
| 13 | PA14 | SWD Debug Pin (SWCLK) | |
| 14 | PA13 | SWD Debug Pin (SWDIO) | |
| 15 | PB4 | I/O | GPIO only |
| 16 | PB15/ADC | I/O | GPIO and ADC |
| 17 | PA2/ADC | I/O | GPIO and ADC |
| 18 | PA8 | I/O | GPIO only |
| 19 | PA12 | I/O | GPIO only |
| 20 | PB14/ADC | I/O | GPIO and ADC |
RF Characteristics
Operating Frequencies
| Module | Region | Frequency |
|---|---|---|
| RAK811(L) | Europe | EU433 |
| China | CN470 | |
| RAK811(H) | Europe | EU868 |
| North America | US915 | |
| Australia | AU915 | |
| Korea | KR920 | |
| Asia | AS923 | |
| India | IN865 |
| Feature | Condition | Minimum | Typical | Maximum | Unit |
|---|---|---|---|---|---|
| Transmit | TX Power | 14 | 20 | dBm | |
| RX Sensitivity | RSSI | -130 | dBm | ||
| SNR | -15 | dB |
Electrical Characteristics
Schematic Diagram
Figure 8284: RAK811 Schematic Diagram
Figure 8285: Reference DesignOperating Voltage
| Feature | Minimum | Typical | Maximum | Unit |
|---|---|---|---|---|
| VCC | 2.1 | 3.3 | 3.45 | Volts (V) |
Current Consumption
| Feature | Condition | Minimum | Typical | Maximum | Unit |
|---|---|---|---|---|---|
| Current Consumption | TX Power | 30 (@ 14 dBm) | mA | ||
| RX Mode | 5.5 | mA |
Sleep Current
| Feature | Condition | Minimum (2.1V) | Typical (3.3V) | Maximum | Unit |
|---|---|---|---|---|---|
| Current Consumption | EU868 | 8.37 | 11.9 | μA | |
| US915 | 1.11 | 11.8 | μA | ||
| CN470 | 1.65 | 3.07 | μA |
Mechanical Characteristics
Module Dimensions
Figure 8286: RAK811 Physical DimensionEnvironmental Characteristics
Operating Temperature
| Feature | Minimum | Typical | Maximum | Unit |
|---|---|---|---|---|
| Operating Temperature | -30 | 25 | 85 | °C |
Storage Temperature
| Feature | Minimum | Typical | Maximum | Unit |
|---|---|---|---|---|
| Storage Temperature | -40 | 85 | °C |
Software
Download the latest firmware of the RAK811 Breakout Board — both in low and high frequency — provided in the table below.
The bin file contains the application code only, and you need the RAK DFU Tool to upload this file to the module.
The hex file contains both the bootloader and the application code. You need to use STM32CubeProgrammer to upload this.
Firmware/OS
| Model | Version | Source |
|---|---|---|
| RAK811(L) | V3.0.0.14.L | Download |
| RAK811(H) | V3.0.0.14.H | Download |
Certification
CE Certification
FCC Certification
KC Certification
JRL Certification
RoHS Certification
