RAK813 BLE+LoRa Module Datasheet

Overview

Description

The RAK813 is a combination of the BLE and LoRa in a single module. The BLE short-range technology combined with low-power LoRa can provide long-distance wireless communication capabilities. Both technologies are low power, eliminating the need to change batteries frequently.

At the same time, RAK813 supports various digital interfaces such as GPIO, UART, I2C, SPI, etc. which are used in connecting sensors to the RAK813 module.

Based on the global leading Nordic Semiconductor Corporation's nRF52832 (BLE) and Semtech's SX127x (LoRa) chipset, the RAK813 module provides a perfect combination of ultra-low-power and ultra-long distance.

The RAK813 module uses TCXO as the LoRa clock source, so at different temperatures (such as indoor and outdoor) LoRa module of radio frequency close to the maximum, can effectively improve the decoding rate, to enhance the communication quality.

RAK813 supports various protocols, including the newest BLE and LoRaWAN, where customers can choose a multi frequency, including 433MHz, 470MHz, 868MHz, and 915MHz.

Features

• Base on nRF52832(BLE) and SX127X (LoRa)
• Supports UART, SPI, I2C, and GPIOs Interface.
• Small size and low power, sleep current down to 2 uA
• High receiver sensitivity: LoRa down to -146dBm, BLE down to -96 dBm
• Operates at a Temperature of -40 °C to 85 °C
• TX Power: LoRa adjustable up to +14 dBm high efficiency PA, max PA boost up to 20 dBm, BLE -20 to +4 dBm in 4 DB steps
• Building in both TX and RX filter
• Building in TCXO for high-frequency stability
• Provides multiple band selection including 433/470/868/915 MHz for LoRa and 2.4 GHz for BLE
• Storage Temperature: -40 °C to 85 °C
• Supports LoRa Point-to-Point Communication in all the bands
• FSK, GFSK, and LoRa Technology modulation
• llP3 = -11 dBm
• Up to 15 km coverage at suburban and up to 5 km coverage at urban areas.

Specifications

Overview

The overview covers the RAK813 board overview with its corresponding outer dimensions. It also includes the block diagram and the system diagram of the module.

Board Overview

Figure 8437: RAK813 Board Dimensions

Block Diagram

The short-range technology nRF52832 (BLE) is paired with the Semtech's SX127x (LoRa) chipset making the RAK813 capable of long-distance wireless communication.

Figure 8438: RAK813 Block Diagram

System Diagram

Figure 8439: System Diagram

Hardware

The hardware specification is categorized into five parts. It discusses the pinouts of the module and its corresponding functions and diagrams. It also covers the electrical, environmental, and mechanical parameters that include the tabular data of the functionalities and standard values of the RAK813 Module.

Pin Definition

Figure 8440: Pin Out Diagram for RAK813

warning

When using LORA_ANT and BLE_ANT pins for antenna and not the IPEX connector variant, there are design considerations to make sure optimum RF performance.

• RF trace must be away from interference (switching node of DC-DC supply, high current/voltage pulses from controllers of inductive load like motor, signal generators, etc.)
• RF trace must have 50 Ohms impedance. It is advisable to use an impedance simulation software tool to achieve this requirement.
• If using an external antenna connector, make it close to the LORA_ANT and BLE_ANT pins.
• Ground plane optimization is critical on certain antenna types like monopole.
• GND trace used for RF path return must be directly connected to the GND plane and not be treated as thermal relief.
• It is recommended for the RF trace to be routed in a curve and not in a sharp 90 degrees.

In addition, with a commitment to making IoT easy, RAK offers a dedicated service for Antenna RF Design which includes PCB design, tuning, matching, and RF testing.

Pin Number	Name	Type	Description
1	GND		Ground connection
2	P0.24_IO	I/O	GPIO port
3	P0.25_LED2	I/O	GPIO port /LED
4	P0.26_LED1	I/O	GPIO port /LED
5	P0.27_KEY1	I/O	GPIO port /KEY
6	P0.28_UART_RXD	O	UART Interface
7	P0.29_UART_TXD	I	UART Interface
8	P0.30_UART_CTS	O	UART Interface
9	P0.31_UART_RTS	I	UART Interface
10	GND		Ground connection
11	VDD_nRF	P	BLE power voltage source input
12	VDD_LoRa	P	LoRa power voltage source input
13	GND	I/O	Ground connections
14	GND	I/O	Ground connections
15	P0.02_AIN0	I/O	GPIO port/ADC input
16	P0.03_AIN1	I/O	GPIO port/ADC input
17	P0.04_AIN2	I/O	GPIO port/ADC input
18	P0.21_nRESET	I	Reset trigger input
19	GND		Ground connection
20	P0.15_I2C_SDA	I/O	GPIO port/I2C
21	P0.16_I2C_SCL	I/O	GPIO port/I2C
22	P0.17_SPI_CS	I/O	GPIO port/SPI
23	P0.18SPI_MISO	I/O	GPIO port/SPI
24	P0.19_SPI_MOSI	I/O	GPIO port/SPI
25	P0.20_SPI_CLK	I/O	GPIO port/SPI
26	SWDCLK	I/O	Debug port
27	SWDIO	I/O	Debug port
28	GND		Ground connection
29	GND		Ground connection
30	LORA_ANT		RF I/O port
31	GND		Ground connection
32	GND		Ground connection
33	BLE_ANT	I/O	RF I/O port

RF Characteristics

LoRa

Characteristics	Condition	Minimum	Typical	Maximum	Unit
LoRa Transmit	TX Power		14	20	dBm
LoRa RX Sensitivity	RSSI	-130			dBm
	SNR	-15			dB

BLE

Characteristics	Condition	Minimum	Typical	Maximum	Unit
BLE Transmit	TX Power		0	4	dBm
BLE RX Sensitivity	Sensitivity	-97			dBm

Electrical Characteristics

Schematic Diagram

Figure 8441: RAK813 Schematic Diagram

Figure 8442: RAK813 Schematic Diagram

Figure 8443: RAK813 Schematic Diagram

Recommended Operation Rating

	Minimum	Typical	Maximum	Unit
VCC	3.15	3.3	3.45	V

Current Consumption

Condition	Minimum	Typical	Maximum	Unit
TX Mode	30 (14 dBm)			mA
RX Mode	5.5			mA
Sleep Mode	7.2			uA

Mechanical Characteristics

Figure 8444: Mechanical Dimensions of RAK813

Environmental Characteristics

Recommended Reflow Profile

Figure 8445: Reflow Profile for RAK813

Models / Bundles

Ordering Information

Model Name	Operation Frequency	Output Power
RAK813-HF	865-870 MHz / 920~928 MHz	5-20 dBm
RAK813-LF	433-435 MHz / 470~510 MHz	5-20 dBm