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RAK18003 WisBlock Audio Interposer Module Datasheet

Overview​

Description​

The RAK18003 is an interposer module, part of the WisBlock Audio Series. The RAK18003 is designed to allow multiple WisBlock Audio modules to be used together on a single IO slot. It consists of two IO expanders (TPT29555-TS5R), one signal switch (5223YWQ10/TR), and connectors where other WisBlock Audio modules can be interfaced. It also has a usable TF card slot.

Features​

  • Module Specifications

    • Interposer board
    • Extend IO for WisBlock Core to control other modules
    • FPC connector for connecting PDM MIC modules
    • TF-card connector
    • BTB connector for WisBlock Audio stack

  • Module Size

    • 25 x 35 mm

Specifications​

Overview​

Figure 3938: RAK18003 WisBlock Audio Interposer Module top and bottom view

Mounting​

The RAK18003 WisBlock Audio Interposer Module can be mounted to the IO slot of the WisBlock Base board. Figure 2 shows the mounting mechanism of the RAK18003 on a WisBlock Base module. Other WisBlock Audio modules can be interfaced via BTB connector.

Figure 3939: RAK18003 WisBlock Audio Interposer Module mounting

Hardware​

The hardware specification is categorized into five (5) parts that cover the chipset and pinouts and the corresponding functions and diagrams of the module. It also covers the electrical and mechanical characteristics that include the tabular data of the functionalities and standard values of the RAK18003 WisBlock Audio Interposer Module.

Chipset​

VendorPart Number
3PEAKTPT29555
SG MICRO CORP5223YWQ10

Pin Definition​

The RAK18003 WisBlock Audio Interposer Module comprises a standard WisBlock connector, FPC connector for PDM MIC modules, a BTB connector for the WisBlock Audio stack, and a TF connector.

WisBlock Connector​

The WisBlock connector allows the RAK18003 module to be mounted to a WisBlock Base board. The pin order of the connector and the pinout definition is shown in Figure 3.

Figure 3940: RAK18003 WisBlock Audio Interposer Module WisBlock Connector Diagram
NOTE
  • VBAT,VBUS,3V3_S, and GND are the power supply from the WisBlock Base.
  • Core_I2C_SDA and Core_I2C_SCL are I2C signals from WisBlock Core which works as a master to communicate with other I2C devices.
  • Core_AIN0 and Core_AIN1 are ADC input for WisBlock Core.
  • CORE_SPI_MISO,CORE_SPI_CLK, and CORE_SPI_MOSI are SPI signals, which work as a master to communicate with other SPI devices.
  • IOEX_INT is a GPIO signal, it connects to the IO expander's INT. When the input to the IO expander changes, the IO expander generates an interrupt signal to be detected by the WisBlock Core.
  • Core_PDM1_Data and Core_PDM1_CLK are PDM signals.
  • Core_I2S_DO, Core_I2S_DI,* Core_I2S_WS*, and Core_I2S_BCLK are I2S signals.
Stack Connector​

The BTB connector is designed to support WisBlock Audio Modules. It allows the RAK18003 module to be stacked with other WisBlock Audio modules, such as RAK18080 (DSP board), RAK18060 (AMP board), and RAK18040 (Analog MIC driver).

Figure 3941: RAK18003 WisBlock Audio Interposer Module BTB Connector diagram
NOTE
  • 3V3, VBAT, VBUS, and GND are power supply from the WisBlock Base board.
  • CORE_SPI_MOSI, CORE_SPI_MISO, and CORE_SPI_CLK are SPI signals from the WisBlock Core which works as the master. CORE_SPI_CS1 and CORE_SPI_CS2 are the SPI's chip select signals. WisBlock Core controls these pins using the IO expander.
  • Core_I2C_SCL and Core_I2C_SDA are I2C signals connected to WisBlock Core which works as the master.
  • AMP_CTR_IO1, AMP_CTR_IO2, and AMP_CTR_IO3 are IO signals form AMP board. WisBlock Core controls these pins using an IO expander.
  • DSP_CTR_IO1, DSP_CTR_IO2, DSP_CTR_IO3, DSP_CTR_IO4, and DSP_CTR_IO5 are IO signals form DSP board. WisBlock Core controls these pins using an IO expander.
  • Core_AIN0 and Core_AIN1 are ADC input for the WisBlock Core.
  • DSP_PDM1_CLK,DSP_PDM1_Data,DSP_PDM2_CLK, and DSP_PDM2_Data are PDM signals for DSP board.
  • Core_Reset is a hardware reset signal from WisBlock Base.
  • DSP_Check and AMP_Check are used to check whether a DSP board or AMP board is connected. This pin is low when there is no DSP or AMP board and will be high when connect to a DSP or AMP board.
  • CORE_I2S_DO, CORE_I2S_DI, CORE_I2S_WS, and CORE_I2S_BCLK are I2S signals.
  • AMP_CTR_IO1 is the GPIO from the interposer board. Normally this pin is high. This pin will be low if there is an error within the amplifier and is shared between amplifiers.
FPC Connector​

The FPC connector allows the RAK18003 module to be connected to a PDM MIC board, such as RAK18030.

Figure 3942: RAK18003 WisBlock Audio Interposer Module FPC connector diagram
NOTE
  • 3V3 and GND are the power supply for the MIC boards.
  • MIC_CTR_IO1 is the GPIO from the interposer board which can control the MIC if left or right channel.
  • MIC_PDM1_Data, MIC_PDM1_CLK, MIC_PDM2_Data, and MIC_PDM2_CLK are PDM signals.
  • MIC_Check is a signal to let the interposer board know if a MIC exists in the FPC connector.

Mechanical Characteristic​

Board Dimensions​

Figure 6 shows the dimensions and the mechanical drawing of the RAK18003 module.

Figure 3943: RAK18003 Audio Interposer Module mechanical drawing
WisConnector PCB Layout​
Figure 3944: WisConnector PCB footprint and recommendations

Schematic Diagram​

Figure 3945: RAK18003 Audio Interposer Module schematic diagram